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1

Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors

Noh, Seungjun, Choe, Chanyang, Chen, Chuantong, Zhang, Hao, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2018

Langue:

english

Fichier:

PDF, 2.42 MB

english, 2018

2

Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives

Masahiro Inoue, Hiroaki Muta, Takuji Maekawa, Shinsuke Yamanaka, Katsuaki Suganuma

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 530 KB

english, 2009

3

The effect of micro via‐in pad design on surface‐mount assembly defects: part II – voiding and spattering

Lee, Yong‐Won, Kim, Keun‐Soo, Suganuma, Katsuaki

Journal:

Soldering & Surface Mount Technology

Année:

2013

Langue:

english

Fichier:

PDF, 553 KB

english, 2013

4

Transparent, Conductive, and Printable Composites Consisting of TEMPO-Oxidized Nanocellulose and Carbon Nanotube

Koga, Hirotaka, Saito, Tsuguyuki, Kitaoka, Takuya, Nogi, Masaya, Suganuma, Katsuaki, Isogai, Akira

Journal:

Biomacromolecules

Année:

2013

Langue:

english

Fichier:

PDF, 4.55 MB

english, 2013

5

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

Araki, Teppei, Sugahara, Tohru, Jiu, Jinting, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Uchida, Hiroshi, Shinozaki, Kenji, Suganuma, Katsuaki

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2013

6

Synthesis and characterization of cobalt nanoparticles encapsulated in boron nitride nanocages

Kitahara, Hidehiko, Oku, Takeo, Hirano, Takanori, Suganuma, Katsuaki

Journal:

Diamond and Related Materials

Année:

2001

Langue:

english

Fichier:

PDF, 409 KB

english, 2001

7

[SpringerBriefs in Electrical and Computer Engineering] Introduction to Printed Electronics Volume 74 ||

Suganuma, Katsuaki

Année:

2014

Langue:

english

Fichier:

PDF, 7.77 MB

english, 2014

8

Low-Temperature and Low-Pressure Die Bonding Using Thin Ag-Flake and Ag-Particle Pastes for Power Devices

Soichi, Sakamoto, Suganuma, Katsuaki

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 2.05 MB

english, 2013

9

Thermostable Ag die-attach structure for high-temperature power devices

Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki, Albrecht, Hans-Juergen, Wilke, Klaus

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2016

Langue:

english

Fichier:

PDF, 4.91 MB

english, 2016

10

Process characterization and reliability for the assembly of 01005 chip components

Lee, Yong‐Won, Kim, Keun‐Soo, Suganuma, Katsuaki

Journal:

Soldering & Surface Mount Technology

Année:

2011

Langue:

english

Fichier:

PDF, 422 KB

english, 2011

11

The effect of micro via‐in pad designs on surface‐mount assembly defects: part I – tombstoning

Lee, Yong‐Won, Kim, Keun‐Soo, Suganuma, Katsuaki

Journal:

Soldering & Surface Mount Technology

Année:

2012

Langue:

english

Fichier:

PDF, 479 KB

english, 2012

12

Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates

Chi-Won Hwang, Katsuaki Suganuma

Journal:

Materials Science and Engineering: A

Année:

2004

Langue:

english

Fichier:

PDF, 654 KB

english, 2004

13

The root causes of the “Black pad” phenomenon and avoidance tactics

Katsuaki Suganuma, Kuen-Soo Kim

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2008

Langue:

english

Fichier:

PDF, 2.69 MB

english, 2008

14

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seong-Jun Kim, Keun-Soo Kim

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2009

Langue:

english

Fichier:

PDF, 820 KB

english, 2009

15

Properties of low temperature Sn–Ag–Bi–In solder systems

Keun-Soo Kim, Takayuki Imanishi, Katsuaki Suganuma, Mimoru Ueshima, Rikiya Kato

Journal:

Microelectronics Reliability

Année:

2007

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2007

16

Effect of Interlayers in Ceramic-Metal Joints with Thermal Expansion Mismatches

Katsuaki Suganuma, Taira Okamoto, Mitsue Koizljmi, Masahiko Shimada

Journal:

Journal of the American Ceramic Society

Année:

1984

Langue:

english

Fichier:

PDF, 217 KB

english, 1984

17

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young-Sun Kim, Keun-Soo Kim, Chi-Won Hwang, Katsuaki Suganuma

Journal:

Journal of Alloys and Compounds

Année:

2003

Langue:

english

Fichier:

PDF, 1.87 MB

english, 2003

18

Atomic structure and electronic state of boron nitride fullerenes and nanotubes

Hirano, Takanori, Oku, Takeo, Suganuma, Katsuaki

Journal:

Diamond and Related Materials

Année:

2000

Langue:

english

Fichier:

PDF, 293 KB

english, 2000

19

A Miniaturized Flexible Antenna Printed on a High Dielectric Constant Nanopaper Composite

Inui, Tetsuji, Koga, Hirotaka, Nogi, Masaya, Komoda, Natsuki, Suganuma, Katsuaki

Journal:

Advanced Materials

Année:

2015

Langue:

english

Fichier:

PDF, 1.75 MB

english, 2015

20

Pressureless Bonding Using Sputtered Ag Thin Films

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2014

21

Silver stress migration bonding driven by thermomechanical stress with various substrates

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 1016 KB

english, 2015

22

Laser-induced forward transfer of high-viscosity silver precursor ink for non-contact printed electronics

Inui, Tetsuji, Mandamparambil, Rajesh, Araki, Teppei, Abbel, Robert, Koga, Hirotaka, Nogi, Masaya, Suganuma, Katsuaki

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 483 KB

english, 2015

23

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

Jiu, Jinting, Zhang, Hao, Nagao, Shijo, Sugahara, Tohru, Kagami, Noriko, Suzuki, Youji, Akai, Yasuyuki, Suganuma, Katsuaki

Journal:

Journal of Materials Science

Année:

2016

Langue:

english

Fichier:

PDF, 1.43 MB

english, 2016

24

Power electronics packaging

Suganuma, Katsuaki, Song, Jenn-Ming, Lai, Yi-Shao

Journal:

Microelectronics Reliability

Année:

2015

Langue:

english

Fichier:

PDF, 130 KB

english, 2015

25

Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material

Jiu, Jinting, Zhang, Hao, Koga, Shunsuke, Nagao, Shijo, Izumi, Yasuha, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2015

26

Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment

Park, Semin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 5.65 MB

english, 2015

27

Interface Structure of Si3N4 Matrix Composite with Nano-Meter Scale Sic Particles

Sasaki, Gen, Suganuma, Katsuaki, Fujita, Teruaki, Hiraga, Kenji, Niihara, Koichi

Journal:

MRS Proceedings

Année:

1992

Langue:

english

Fichier:

PDF, 2.34 MB

english, 1992

28

Dissolution of copper on Sn‐Ag‐Cu system lead free solder

Izuta, Goro, Tanabe, Tsuyoshi, Suganuma, Katsuaki

Journal:

Soldering & Surface Mount Technology

Année:

2007

Langue:

english

Fichier:

PDF, 460 KB

english, 2007

29

The behaviour of solder pastes in stencil printing with electropolishing process

Lee, Yong‐Won, Kim, Keun‐Soo, Suganuma, Katsuaki

Journal:

Soldering & Surface Mount Technology

Année:

2013

Langue:

english

Fichier:

PDF, 459 KB

english, 2013

30

Mechanical Properties and Microstructure of Si3N4 Matrix Composite with Nano-Meter Scale SiC Particles

SASAKI, Gen, NAKASE, Hirofumi, SUGANUMA, Katsuaki, FUJITA, Teruaki, NIIHARA, Koichi

Journal:

Journal of the Ceramic Society of Japan

Année:

1992

Langue:

english

Fichier:

PDF, 2.23 MB

english, 1992

31

[IEEE 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) - Sendai, Japan (2016.8.22-2016.8.25)] 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) - High thermal stability of SiC packaging with thermosetting imide-based nanocomposite encapsulating materials combined with sintered Ag paste die-attach

Sugioka, Takuo, Nagao, Shijo, Ogawa, Satoshi, Fujibayashi, Teruhisa, Sumida, Yasutaka, Hao, Zhang, Suganuma, Katsuaki

Année:

2016

Langue:

english

Fichier:

PDF, 310 KB

english, 2016

32

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Li, Wanli, Li, Cai-fu, Lang, Fengpei, Jiu, Jinting, Ueshima, Minoru, Wang, Hao, Liu, Zhi-Quan, Suganuma, Katsuaki

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 8.47 MB

english, 2018

33

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure

Kim, Dongjin, Chen, Chuantong, Suetake, Aiji, Choe, Chanyang, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 2.97 MB

english, 2018

34

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver

Choe, Chanyang, Noh, Seungjun, Chen, Chuantong, Kim, Dongjin, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 3.15 MB

english, 2018

35

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Enhanced high temperature stability of printed Cu wirings based on large Cu particle ink, Ag element addition, and intense pulsed light sintering

Li, Wanli, Li, Linying, Li, Cai-Fu, Jiu, Jinting, Suganuma, Katsuaki

Année:

2018

Langue:

english

Fichier:

PDF, 7.49 MB

english, 2018

36

Large-area die-attachment by silver stress migration bonding for power device applications

Noh, Seungjun, Zhang, Hao, Yeom, Jeyun, Chen, Chuantong, Li, Caifu, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 1.72 MB

english, 2018

37

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Improvement in bonding strength of Ag sinter joining on gold surface finished substrates by increasing the gold grain size

Zhang, Zheng, Chen, Chuangtong, Kurosaka, Seigo, Suganuma, Katsuaki

Année:

2018

Langue:

english

Fichier:

PDF, 263 KB

english, 2018

38

Die-Attach Technology for Wide Band Gap Semiconductor; ワイドバンドギャップパワー半導体のダイアタッチ技術;

SUGANUMA, Katsuaki

Journal:

Journal of The Surface Finishing Society of Japan

Année:

2018

Fichier:

PDF, 4.05 MB

2018

39

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

Kim, Dongjin, Yamamoto, Yasuyuki, Nagao, Shijo, Wakasugi, Naoki, Chen, Chuantong, Suganuma, Katsuaki

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 5.20 MB

english, 2019

40

[IEEE 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) - New Orleans, LA, USA (2020.3.15-2020.3.19)] 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) - Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications

Chen, Chuantong, Zhang, Zheng, Kim, Dongjin, Suganuma, Katsuaki

Année:

2020

Fichier:

PDF, 1.28 MB

2020

41

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications: Ag sinter joining and encapsulation resin adhesion

Chen, Chuantong, Zhang, Zheng, Suganuma, Katsuaki

Année:

2020

Fichier:

PDF, 595 KB

2020

42

ChemInform Abstract: Carbon Nanocage Structures Formed by One-Dimensional Self-Organization of Gold Nanoparticles.

Takeo Oku, Katsuaki Suganuma

Journal:

Année:

2000

Fichier:

PDF, 25 KB

2000

43

Mechanical properties changes of Fe-Cr alloys by fast neutron irradiation

Katsuaki Suganuma, Hideo Kayano, Seishi Yajima

Journal:

Journal of Nuclear Materials

Année:

1982

Langue:

english

Fichier:

PDF, 2.96 MB

english, 1982

44

Saturation exposure in ferritic stainless steels

Katsuaki Suganuma, Hideo Kayano

Journal:

Journal of Nuclear Materials

Année:

1983

Langue:

english

Fichier:

PDF, 133 KB

english, 1983

45

Irradiation hardening of Fe-Cr alloys

Katsuaki Suganuma, Hideo Kayano

Journal:

Journal of Nuclear Materials

Année:

1983

Langue:

english

Fichier:

PDF, 583 KB

english, 1983

46

Solid-state bonding of oxide ceramic to steel

Katsuaki Suganuma, Taira Okamoto, Mitsue Koizumi, Masahiko Shimada

Journal:

Journal of Nuclear Materials

Année:

1985

Langue:

english

Fichier:

PDF, 493 KB

english, 1985

47

Novel method for room temperature sintering of Ag nanoparticle paste in air

Daisuke Wakuda, Mariko Hatamura, Katsuaki Suganuma

Journal:

Chemical Physics Letters

Année:

2007

Langue:

english

Fichier:

PDF, 666 KB

english, 2007

48

Synthesis of Co nanocapsules coated with BN layers by annealing of KBH4 and [Co(NH3)6]Cl3

Ichihito Narita, Takeo Oku, Hisato Tokoro, Katsuaki Suganuma

Journal:

Solid State Communications

Année:

2006

Langue:

english

Fichier:

PDF, 434 KB

english, 2006

49

Sn–Zn low temperature solder

Katsuaki Suganuma, Kuen-Soo Kim

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2007

Langue:

english

Fichier:

PDF, 505 KB

english, 2007

50

Influential factors in determining the adhesive strength of ACF joints

Masahiro Inoue, Katsuaki Suganuma

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2009

Langue:

english

Fichier:

PDF, 650 KB

english, 2009